- interconnect process
- технология межсоединений
Англо-русский словарь по вычислительной технике и информационным технологиям - 4-е изд.. Сергей Орлов .
interconnect process
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Process corners — In semiconductor manufacturing, a process corner is an example of a design of experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners … Wikipedia
Process Automation System — A process control or automation system is used to automatically control a process such as chemical, oil refineries, paper and pulp factories.The PAS often uses a network to interconnect sensors, controllers, operator terminals and actuators. A… … Wikipedia
Molded Interconnect Device — A Molded Interconnect Device is an injection molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the … Wikipedia
Semiconductor process simulation — is the modeling of the fabrication of semiconductor devices such as transistors. It is a branch of electronic design automation, and part of a sub field known as technology CAD, or TCAD. 400px|right|thumb|This figure shows a result from… … Wikipedia
Copper interconnect — Copper based chips are semiconductor integrated circuits, usually microprocessors, which use copper for interconnections. Since copper is a better conductor than aluminium, chips using this technology can have smaller metal components, and use… … Wikipedia
Peripheral Component Interconnect — Infobox Computer Hardware Bus name = PCI fullname = peripheral component interconnection caption = Five 5V 32 bit PCI expansion slots on a motherboard invent date = July 1993 invent name = Intel super date = 2004 super name = PCI Express width =… … Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
Electromigration — is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current… … Wikipedia
Cell (microprocessor) — Cell is a microprocessor architecture jointly developed by Sony Computer Entertainment, Toshiba, and IBM, an alliance known as STI . The architectural design and first implementation were carried out at the STI Design Center in Austin, Texas over … Wikipedia
Simucad — Infobox Company company name = Simucad Design Automation, Inc. company company type = Private Company| foundation = 2004 location = key people = Dr Ivan Pesic, President/CEO Mr Marc Goldberg, Sales Contact industry = Software Programming homepage … Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
